Specifications: The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy, bakelite and urea formaldehyde molding powder, etc. Including preformed project such as compressed molding, transfer molding and extrusion molding, etc. The h. F. Preheating process is widely applied for thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of ic, commutator, transistors and other micro-electronic components. The device can be used to improve the surface glossiness of products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic components and semi-conductor ic, so as to improve the grade and performance for the products.